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Welcome to SIdoctor Technologies!

 SIdoctor offers consulting services for your successful high-speed digital system design. SIdoctor features:

  • Long professional experience at leading high-tech companies such as Intel Corp., Teradyne Corp., and Lattice Semiconductor Corp.
  • 3D full-wave Electromagnetic modeling, simulations and analysis using advanced professional tools, with proven results.
  • Ph.D. in Electrical Engineering: 6 issued US patents IP
  • Advanced knowledge through research
  • Competitive price

Signal Integrity

Bandwidth growth with smaller form factors at speeds of 100G today and 400G tomorrow is necessary to support 5G and IOT technologies.  The faster signal rise and fall times mean high frequency signal components!.  CROSSTALKs, both near-end crosstalk (NEXT) and far-end crosstalk (FEXT) become more severe; LOSSES: skin effect,  dielectric losses, rough surface scatterings, and radiation losses, become significant; and NONIDEAL RETURN PATHS start to show up. These effects will degrade your system's signal integrity...

 

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Power Integrity

Example: small lightweight IOT devices must be extremely power efficient. To prevent product malfunction or failure caused by voltage loss on critical supply nets, it is important to analyze power intergrity during layout. Excessive current density and unpredictable circuit behaviors must be paid attentions....

Developed by my colleague, Dr. Cosmin Iorga, a novel method for power integrity analysis and power delivery network (PDN) models extraction, in FPGA systems by configuring the FPGA to function as a Vector Network Analyzer (VNA) test instrument for its own power delivery network, please visit the website:  piscanner.com

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Electromagnetic Compatibility

Example: EMI electromagnetic interferrence, RF modules/blocks need shieldings and via stiching etc.! As such, consideration for, must become part of the IOT product design and analysis methodology. Common sources of EMI are Components' parasitic L&C, PCBs' post-layout parasitic L&C, Systems and Components' Instability, and Non-harmonic rings. Both common-mode EMI and differential-EMI must be reduced in order to meet the stringent standards such as FCC, CISPR etc.; PCB layout parasitic must be accurately extracted via 3D EM solver/modeler, and lowered; EMI noise filters can be properly used....

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Chansungsan, Chai

Our Philosophy&Values

SIdoctor is customer-oriented. Because you put your trust in us, you deserve our best effort and attention. We strive to make your design successful. We are not successful, if you are not.

SIdoctor's moto: "We run the extra sims for you"

 

Biography:

Dr. Chaiyuth Chansungsan has earned his Ph.D. in Electrical Engineering from the University of Washington, Seattle; and his MS. in Electrical Engineering from UCLA, Los Angeles. His professional experience from leading IC companies such as Intel Corp., Teradyne Corp., and Lattice Semiconductor Corp. , includes signal integrity, power integrity, full-link interconnect modeling, on-die noise measurement methodology, and high-speed I/O design. Dr. Chai has 6 issued US patents&IP, and has published 6 technical research papers. He has received an Intel's quality award.  Dr. Chai is a senior member of IEEE and vice president of IEEE Buenaventura's Electron Devices and Circuits&Systems Chapter.  He had also attended MBA program and online project management trainings.

Testimony

 

“Dr. Chai and Sidoctor helped our team realize high speed mixed signal design that pushed current state-of-the-art. Dr. Chai has made careful planning and efficient execution of the design while patiently reviewing our team’s feedback/concerns during the course of the project. Sidoctor made it possible for us to catch our fabrication deadline on time on short notice. We look forward to working with Sidoctor for our future high speed designs and highly recommend their team."
Phaneendra Bikkina,
Program Manager,
Alphacore Inc.

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